Recent Situation of Lead-free Solder Technology

Lead-free Solder Assembly

Until non-lead solder conversion is mature, the evaluation of materials and components is likely to identify trade-offs. The performance of the no-clean andwater-soluble solder pastes that were tested varied widely. Ultimately each company will need to determine which attributes are most important for their product line. Also components needed for a product may not be currently available as lea...

Lead-free Solder Assembly: Impact and Opportunity

There has been major interest in Lead-free soldering within the electronics assembly industry for the last several years, and this will continue with the agreement on the language and implementation dates of the WEEE/ROHS legislation in the EU. This paper will focus on several topics critical to the implementation of lead-free soldering. These topics include the impact of Tin-silver-copper as t...

Lead-free Solder Joint Quality Investigation

New Pb-free materials ask thorough verification because their properties as wetting, solderability and mechanical properties are different from these SnPb. In this paper are presented some new facts from creep and stress relaxation investigation including new arrangement for measurement. Results from creep, stress, shear and bend testing are presented for three types of solder (Sn/3.5Ag, Sn/3.8...

Lead-Free Soldering for Space Applications Lead-Free Solder Body of Knowledge

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn–4Ag–0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some observations on samples that were subjected to 1000°C /cm thermal gradient (TG) for 286 h, 712 h, and 1156 h. It was observed that samples subjected to thermal gradient did not develop a Cu3Sn inter...